J. F. Zheng, H. V. Demir, V. A. Sabnis, O. Fidaner, J. S. Harris and D. A. B. Miller, "Self-aligned via and trench for metal contact in III-V semiconductor devices," Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 24(3), 1117-1122 (2006). [more info]
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